An ESD protection device is provided for an integrated circuit. The ESD
protection device includes a power supply clamp device formed from a diode
and coupled between a first power supply V.sub.CC and a second power
supply V.sub.SS. An input protection device is also provided which is
formed from a diode coupled between an input pad and the first power
supply and a second diode coupled between the input pad and a second power
supply. The diodes have an adjusted reverse breakdown voltage that is
higher than the voltage supply V.sub.CC used to power the peripheral
circuitry that drives circuitry within a core of the integrated circuit.
The adjusted reverse breakdown voltage is also lower than the breakdown
voltage of gate oxide layers used within the peripheral circuitry.
