A high efficiency heat dissipated power supply comprises a base and a
cover. The base receives power from a plug at a rear side thereof. The
voltage of power is reduced, and is rectified by an electronic circuit for
being used by a computer mainframe. A bank of fans are installed at a rear
side of the base so that the fan absorbs air between the cover and base;
and then guide the air to blow out the air. An interior of the cover has
at least one cover fan. The cover fans are actuated by a power source.
Then the air is exhausted by an exhausting fan at a rear side of the base.
Thereby, air flows along three paths so that convection air is formed at
the interior and exterior of the power supply; as a result heat
dissipating efficiency is increased so that capacity and output power are
increased.
