A moisture-reactive hot-melt adhesive composition is provided.
Particularly, a composition that includes a polyether polyol, a polyester
polyol, a styrene/allyl alcohol copolymer, and a polyisocyanate. More
particularly, the components are chosen so that the ratio of NCO/OH groups
on an equivalents basis is from 1.8/1 to 3.0/1; the components contain
less than 1% by weight of water; the weight ratio of polyether polyol to
polyester polyol is at least 0.42; and the free NCO content is at least
5.5% by weight. Also provided are a method for forming the adhesive
composition and a method for bonding substrates using the adhesive.
