There is provided such a structure that a first insulating layer, a
conductive pattern, a second insulating layer, a capacitor Q, a third
insulating layer, and a lower electrode leading wiring are formed
sequentially on a semiconductor substrate, and a lower electrode of the
capacitor is connected to an upper surface of the conductive pattern, and
the lower electrode leading wiring is also connected electrically to the
conductive pattern from its upper side.
