The present invention is to provide a dicing method of cutting a workpiece along the first streets and the second streets by using a cutting blade having an annular cutting edge provided on the outer peripheral portion on one side surface of a base plate, the workpiece having plural first streets and second streets intersected each other at a predetermined angle. When the second streets are to be cut after the first streets are cut, the cutting blade is so positioned that the side of the base plate faces the side of the unworked region of the workpiece.

 
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< Method and device for protecting micro electromechanical system structures during dicing of a wafer

< Thinning and dicing of semiconductor wafers using dry etch, and obtaining semiconductor chips with rounded bottom edges and corners

> Resinoid dicing blade including a dry lubricant

> Semiconductor device produced by dicing

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