A circuit includes a first integrated circuit or die having a first circuit and a first inductive interface. A second integrated circuit or die has a second circuit and a second inductive interface. The first inductive interface and the second inductive interface are aligned to magnetically communicate signals between the first circuit and the second circuit.

 
Web www.patentalert.com

< Glass-based micropositioning systems and methods

< Method for placing active circuits beneath active bonding pads

> Semiconductor device package

> Stacked integrated circuit package system

~ 00620