The invention provides a solder alloy for bonding an oxide material, including more than 0% but not more than 1.0% of Mg and the balance being substantially Bi and Sn. Preferably, the alloy includes 0.01 to 0.6% of Mg, 35 to 86% of Bi, and the balance being substantially Sn. The invention can be used for bonding an oxide material, such as bonding glasses to each other. According to the invention, a low-cost solder joint of an oxide material is also provided.

 
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< High fracture toughness aluminum-copper-lithium sheet or light-gauge plate suitable for use in a fuselage panel

< Group I-III-VI quaternary or higher alloy semiconductor films

> Nickel-rhenium alloy powder and conductor paste containing the same

> Oxidation resistant high creep strength austenitic stainless steel

~ 00620