A semiconductor device includes a plurality of chips comprising a plurality of first moisture-proof rings individually surrounding said plurality of chips, a second moisture-proof ring surrounding the entire plurality of chips, and a wire for connecting said plurality of chips to each other.

 
Web www.patentalert.com

< Resin mold type semiconductor device

< Integrated circuit package system including shield

> Semiconductor device and method of manufacturing the same

> Image sensor package and packaging method for the same

~ 00611