Herein disclosed an electronic component having a passivation layer in which an opening that exposes a part of a pad electrode is formed, an underlying metal layer formed on the pad electrode and the passivation layer, and a barrier metal layer formed on the underlying metal layer for an external connection electrode, the electronic component including a recess or/and a projection configured to be provided under the barrier metal layer outside or/and inside the opening, the underlying metal layer being formed on the recess or/and the projection and having a surface shape that follows the recess or/and the projection.

 
Web www.patentalert.com

< Assembling stacked substrates that can form cylindrical inductors and adjustable transformers

< Image sensor with metal interconnection having protruding convex shape with photodiode conformally following metal interconnection shape and method of manufacturing the same

> Microelectronic devices having an EMI shield and associated systems and methods

> Semiconductor device, wiring substrate, and method for manufacturing wiring substrate

~ 00611