In order to improve signal to noise ratio and reduce electromagnetic interference, it is presently contemplated to connect ground potential on an electronic package mounted to a printed circuit board directly to a commonly grounded surface of a device via an improved die ground lead with a first end connected to an electrical circuit within the electronic package, and a second end extending away from the electronic package and compressively contacting, rather than forming a bonded or soldered connection to, the commonly grounded surface. By way of example and not limitation, the improved die ground lead may be any one of a tie bar, a metal lead, a pogo pin, and a spring. The use of this configuration for the ground connection between the electrical circuit and the commonly grounded surface results in significantly less physical distance than conventional ground paths for electrical circuits within electronic packages.