Disclosed is a method, system, and computer program product for timing closure with concurrent models for fabrication, metrology, lithography, and/or imaging processing analyses for electronic designs. Some embodiments of the present invention disclose a method for timing closure with concurrent process model analysis which comprises the act of generating a design for the one or more interconnect levels; analyzing the effects of the concurrent models to predict feature dimension variations based upon the concurrent models; modifying the design files to reflect the variations; determining one or more parameters based upon the concurrent models; and determining the impact of concurrent models upon the electrical and timing performance. Some embodiments disclose a computerized system for implementing the method(s) disclosed herein. Some embodiments also disclosed a computer program product comprising executable code for the method(s) disclosed herein.