A semiconductor chip scale package formed with through-vias, which can be either isolated or electrically connected to a substrate, and a method of producing the semiconductor chip scale package with through-vias, which can be isolated or electrically connected to the substrate.

 
Web www.patentalert.com

< Semiconductor device having multilayer wiring structure

< Shapes-based migration of aluminum designs to copper damascene

> Semiconductor chip and semiconductor device including the same

> Method of manufacturing semiconductor device

~ 00607