A package structure and method of packaging for a MEMS device is described. A transparent substrate having an interferometric modulator array formed thereon is shown. A single or dual-layered backplate is joined to a frame that circumscribes the modulator array. The frame is bonded to the transparent substrate and to the backplate to provide a hermetic package.

 
Web www.patentalert.com

< Microdevice, microdevice array, amplifying circuit, memory device, analog switch, and current control unit

< Apparatus for providing correlated double sampling of analog video data from an image pixel array

> Multi-purpose periscope with display and overlay capabilities

> Microelectromechanical device and method utilizing nanoparticles

~ 00606