An alignment mechanism to align a microelectronic device to a socket, the device including an array of contact pads thereon. The mechanism includes a socket system having a socket and a device positioning mechanism disposed adjacent the socket and adapted to position the device in the socket. The mechanism also includes a control system adapted to receive alignment data on a position of the array of contact pads relative to two reference sides of the device, the control system further being adapted to control the device positioning mechanism as a function of alignment data to align the device in the socket.