An electronic circuit in a package-in-package configuration and a production method is disclosed. One embodiment provides an arrangement enveloped by an encapsulation and composed of at least one semiconductor element on an element carrier, at least one leadframe with at least one inner contact-connection, at least one inner lead running within the encapsulation, and at least one outer contact-connection led out from the encapsulation. The inner lead has an exposed inner lead section which can be contact-connected from the outer side of the package-in-package configuration.