A phosphor-containing addition-curable silicone resin composition is provided. The composition is capable of forming a cured product which exhibits excellent crack resistance and shock resistance, and minimal surface tackiness. The composition includes (A) an organopolysiloxane including R.sup.1SiO.sub.1.5 units (T units), R.sup.2.sub.2SiO units (D units), and R.sup.3.sub.aR.sup.4.sub.bSiO.sub.(4-a-b)/2 units (wherein, R.sup.1, R.sup.2 and R.sup.3 represent a methyl group or the like, R.sup.4 represents a vinyl group or allyl group, a represents an integer from 0 to 2, b represents 1 or 2, and a+b is either 2 or 3), in which the number of repetitions of the D units is within a range from 5 to 300; (B) an Si--H-containing polysiloxane including T units, D units, and R.sup.3.sub.cH.sub.dSiO.sub.(4-c-d)/2 units (wherein, c represents an integer from 0 to 2, d represents 1 or 2, and c+d is either 2 or 3), in which the number of repetitions of the D units is within a range from 5 to 300, in sufficient quantity that the molar ratio of Si-bonded hydrogen atoms within (B), relative to vinyl groups or allyl groups within (A), is within a range from 0.1 to 4.0; (C) a catalyst; and (D) a phosphor.