The bow in a wafer that results from fabricating a large number of MEMS devices on the top surface of the passivation layer of the wafer so that a MEMS device is formed over each die region is reduced by forming a stress relief layer between the passivation layer and the MEMS devices.

 
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< Characterization and verification for integrated circuit designs

< Organic electronic device with microcavity structure

> Device having an array of embedded capacitors for power delivery and decoupling of high speed input/output circuitry of an integrated circuit

> Semiconductor package preventing generation of static electricity therein
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