An earmuff assembly with a double-shell structure is disclosed for use with a sound-attenuating circumaural headset. The earmuff assembly comprises a cup-shaped outer shell mounted on a resilient outer sealing ring and a cup-shaped inner shell mounted on a resilient inner sealing ring. By means of the two sealing rings the outer and the inner shells are brought into abutment with the head surface around an ear of a wearer. Both shells are structurally rigid. The sound attenuation performance is maximized by isolating the inner shell from the outer shell. The two sealing rings are interconnected through a thin skin layer of soft compliant materials, which acts as a vibration isolating/decoupling means between the outer shell and the inner shell.