A method of enhancing yield of semiconductor integrated circuit includes
determining multiple experimental values, each experimental value
corresponding to a distance from a side of a hole to an opposing side of
a shape surrounding the hole, forming test patterns representing each of
the experimental values on a wafer and calculating experimental
value-based systematic fault rates from the test patterns; converting the
experimental value-based systematic fault rates of the hole into the
experimental value-based systematic fault rates, calculating a length of
a side of the hole for which a distance between the side of the hole and
the opposing side of the shape corresponds to each of experimental
values, and calculating a systematic fault rate of the hole using the
experimental value-based systematic fault rates per unit hole length and
the length of the sides of the hole calculated for the respective
experimental values in the desired layout.