To prevent or alleviate the occurrence of stress in the junction portion
between the semiconductor element and the semiconductor package for
mounting the semiconductor element, so that cracks will not occur even
when there is mounted a semiconductor element having a low strength. A
package for semiconductor devices is formed as a laminate of many layers
including a plurality of conducting layers and insulating resin layers
that are alternately laminated one upon the other and having, on one
surface of the laminate, a portion for mounting a semiconductor element.
The whole region or some region(s) of the insulating resin layers of the
laminate, including at least the portion for mounting the semiconductor
element and the peripheries thereof, are constituted by a prepreg
obtained by impregnating a woven fabric of a liquid crystal polymer with
an insulating resin.