A heat dissipation system includes a heat sink, a heat pipe, and a cooling
assembly. The heat sink includes a substrate and a number of fins
extending therefrom. The heat sink has a receiving portion. The heat pipe
includes a shell, a wick, and a working fluid contained in the shell. The
heat pipe has an evaporation section and a condensation section. The
evaporation section is inserted into the receiving portion of the
substrate while the condensation section is equipped with the cooling
assembly. A hydrophilic layer is formed on the wick so that the
capillarity of the wick is enhanced. The heat dissipation system has two
mechanisms by which to dissipate heat from a heat-generating component,
i.e., via the heat sink and the heat pipe. Therefore, an efficiency of
heat dissipation of the heat dissipation system is improved.