Adapter module securable to a socket frame, integrated circuit module assembly and method for securing a heat dissipation device in direct thermal communication with an integrated circuit module. The socket frame is positioned over a substrate having a land grid array and the frame is secured to the substrate. The frame defines a well for selectively receiving the integrated circuit module in electronic communication with the land grid array. The adapter module is secured to the frame and extends outside the perimeter of the frame. The adapter provides a feature outside the perimeter of the frame for fastening the heat dissipation device. Furthermore, the adapter body is secured to the frame without adding holes through the substrate, such as by extending under the frame to be secured between the frame and substrate, or by extending over the frame to be secured between the frame and fasteners.