Better semiconductor encapsulation is achieved with a liquid epoxy resin composition comprising (A) a liquid epoxy resin, (B) a curing agent containing at least 5 wt % of an aromatic amine compound, (C) a microencapsulated catalyst containing a phenolic hydroxy-bearing benzoic acid derivative, and optionally, (D) an inorganic filler.

 
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> Compounds specific to adenosine A.sub.1 and A.sub.3 receptors and uses thereof

> Human antibodies that bind human IL-12

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