Porous microparticles of high-purity tantalum may be processed in a vacuum plasmatron using a hollow cathode and spraying apparatus in which the coolant is in the form of a metal surface. In one embodiment, the initial powder of tantalum is introduced through a coaxial hole in a hollow cathode and supplied to a vertical column of plasma by inert gas and exposed to heating to temperatures close to the melting point of tantalum. The atomizing tantalum particles are directed through a hole in the anode and collide with a rotating inclined tantalum substrate and cooled from within water, thereby flattened and solidifying the particles.