The present invention provides a nozzle device comprising a substantially cylindrical nozzle body and a cup member which is arranged within the cylinder of the nozzle body and jets out fluid droplets from the tip thereof while being driven to turn, wherein two or more fluids including a detergent and a gas are mixed and jetted out of the tip of the nozzle in order to achieve sufficient cleaning of a single wafer without a re-adhesion of contamination or destruction of the pattern of the wafer. Therefore, the fluid droplets can be controlled to a smaller size than the conventional double-fluid cleaning system or high pressure jet system.