Methods of making metal/dielectric/metal structures include casting copper slurry onto a fugitive substrate to form the first electrode and subsequently casting dielectric and copper slurries onto the first electrode, removing the fugitive substrate and co-firing the structure, wherein the dielectric comprises glass in an amount that is less than 20% by weight of the total inorganic composition and the dielectric achieves substantially complete densification. Alternatively, a metal tape and a dielectric tape, comprising glass in the above amount, may be formed and laminated together to form a metal/dielectric/metal green tape structure, which is co-fired, such that the structure achieves substantially complete densification.