A method for designing a device that comprises a first semiconductor chip,
a second semiconductor chip and an adjustment target is disclosed. The
first semiconductor chip comprises an input pad, a first power supply pad
and a first ground pad. The second semiconductor chip comprises an output
pad coupled to the input pad. The adjustment target is connected to the
first and the second semiconductor chips. A main target variable is
calculated from an input circuit chip model, an output circuit chip model
of the second semiconductor chip in frequency domain and a target
impedance model of the adjustment target in frequency domain. The input
circuit chip model is created by representing the first semiconductor
chip in frequency domain in consideration of a first capacitor model
between the input pad and the first power supply pad, a second capacitor
model between the input pad and the first ground pad, and a chip internal
capacitor model between the first power supply pad and the first ground
pad. The main target variable is compared with a predetermined constraint
represented in frequency domain to decide design guidelines for the
adjustment target.