An optical module has a lens holder with a lens assembly of, for example, three lenses and a diaphragm. The lenses and the optional diaphragm are unequivocally oriented by the geometrical form thereof such that no other optical adjustment is required. The optical module has a specially embodied circuit carrier with a thin region and a thick region that holds the thin, relatively sensitive region as in a frame, the thin region preferably carrying a semiconductor element. Along with the particularly low tolerances between the semiconductor element and the lens unit, the invention advantageously enables a more reliable assembly (e.g. soldering, gluing, etc.) of a semiconductor element, for example in flip-chip mounting technology, on a thin and thus relatively stable, flat plane, than comparable assembly processes of components on exclusively flexible circuit carriers. The optical module is particularly suitable for interior and exterior applications on motor vehicles.