An electronic component or assembly that is assembled within a case that is designed to operate as a liquid phase to gas phase heat pipe where the electronic component or assembly is introduced into a liquid or partially liquid partially gaseous environment; whereby said liquid evaporates into a gas absorbing heat energy and transferring it to and through the component's or assembly's case. The case will be engineered out of materials that do not contaminate the liquid and electronics with ions and will be engineered to include a plurality of chambers/towers that extend in various directions providing enhanced heat pipe functionality in any physical orientation.