A camera module, including a printed circuit board, an image sensor chip, and a housing, is provided. A plating line can be formed in an inner layer of the printed circuit board. A method of manufacturing the camera module can include connecting the plating line of the inner layer of the printed circuit board to a pattern of an outer layer using a via hole, performing a plating process, and forming an image sensor, the housing, and a lens part on the printed circuit board.

 
Web www.patentalert.com

< Dynamic auto-focus window selection that compensates for hand jitter

> Method and apparatus for calculating a focus metric

> Digital camera having a mode-selecting screen

~ 00585