A thermal module includes at least one heat dissipating element, at least one cooling chip, and a heat radiating unit. The cooling chip has a cold end in contact with one side of the heat dissipating element and a hot end in contact with the heat radiating unit. With the cooling chip in direct contact with the heat radiating unit and the heat dissipating element, the heat dissipating element can be directly cooled by the cooling chip, and the thermal module can have a simplified structure to occupy a reduced room while providing enhanced heat dissipating efficiency and accordingly upgraded heat-dissipating effect.