A heat sink assembly includes a base plate, a fin group and a heat pipe
thermally connecting the base plate with the fin group. The fin group
includes a plurality of fins. The heat pipe includes a straight
evaporating section contacting with the base plate, a first condensing
section extending upwardly from an end of the evaporating section and
through the fins, a second condensing section bent downwardly from a free
end of the first condensing section and through the fins, and a third
condensing section extending upwardly from an opposite end of the
evaporating section and through the fins. Periphery walls of at least two
of the first, second and third condensing sections substantially totally
contact with the fins to increase a contact area between the heat pipe
and the fins.