A method for making a transistor within a semiconductor wafer. The method may include etching a recess at source/drain extension locations and depositing amorphous silicon within the recess to from amorphous silicon source/drain extensions. Dopants may be implanted into the amorphous silicon source/drain extensions and the semiconductor wafer may then be annealed.

 
Web www.patentalert.com

< Methods for fabricating a split charge storage node semiconductor memory

> Interconnect structures with improved electromigration resistance and methods for forming such interconnect structures

> Grain growth promotion layer for semiconductor interconnect structures

~ 00583