A method for manufacturing a micromodule comprising an integrated circuit and an antenna coil electrically connected to the integrated circuit. The method includes manufacturing the integrated circuit and first contact pads of the integrated circuit on a first wafer of semiconductor material, making a conductive winding forming a coil and second contact pads of the coil on a second wafer of semiconductor material, and assembling the first and the second wafers face to face while putting the second contact pads of the coil in contact with the second contact pads of the integrated circuit.