Provided are an inlet for an electronic tag comprising an insulating film,
antennas each made of a conductor layer and formed over one surface of
the insulating film, a slit formed in a portion of each of the antennas
and having one end extending toward the outer edge of the antenna, a
semiconductor chip electrically connected with each of the antennas via a
plurality of bump electrodes, and a resin for sealing the semiconductor
chip therewith; and a manufacturing process of the inlet. By the present
invention, formation of a thin and highly-reliable inlet for a
non-contact type electronic tag can be actualized.