There is provided a semiconductor apparatus which includes a substrate, a semiconductor chip mounted above the substrate, a first resin filled between the substrate and the semiconductor chip, and a second resin formed on the substrate and extending from a side surface of the semiconductor chip toward an outer edge of the substrate. The second resin extends from an intersection of an extension of the side surface of the semiconductor chip and the substrate toward the outer edge of the substrate so that a first stress generated on a contact surface between the first resin and the semiconductor chip and a second stress generated on a contact surface between the first resin or the second resin and the substrate balance out each other.