Provided is an apparatus for auto focusing a workpiece for optical metrology measurements using an optical metrology system. The auto focusing subsystem includes a focus detector having a tilt angle, a capture range, and a plurality of sensors. A processor coupled to the focus detector is configured to utilize the plurality of focus signals measured using the focus detector to determine two or more focus parameters. The two or more focus parameters and calibration data are used to determine an initial position of the workpiece and to generate instructions to move the workpiece to a best focus position. A diffraction signal is measured off a structure on the workpiece using the optical metrology system to determine at least one profile parameter of the structure. The at least one profile parameter is used to modify at least one process variable or equipment setting of a semiconductor fabrication cluster.