Provided are three-dimensional microstructures and their methods of formation. The microstructures are formed by a sequential build process and include microstructural elements which are mechanically locked to one another. The microstructures find use, for example, in coaxial transmission lines for electromagnetic energy.

 
Web www.patentalert.com

< Methods and apparatus to reduce substrate voltage bounces and spike voltages in switching amplifiers

> Varistor body and varistor

> Multilayer positive temperature coefficient thermistor

~ 00574