A wired-circuit-board assembly sheet is provided having removable portions
that are easily removable without any generation of metal powder. The
wired-circuit-board assembly sheet comprises a plurality of suspension
boards with circuits, distinguishing marks for distinguishing
defectiveness of the suspension boards with circuits, and a supporting
sheet for supporting the suspension boards with circuits and the
distinguishing marks, wherein openings are formed in the supporting
sheet, and removable portions which are to be removed when the suspension
boards with circuits are judged defective are located in the openings and
also supported by the supporting sheet via joint portions formed of
resin.