A thin-film device incorporates: a substrate; an insulating layer, a plurality of lower conductor layers, a dielectric film, an insulating layer, a plurality of upper conductor layers and a protection film that are stacked in this order on the substrate; and a plurality of terminal electrodes. One of the terminal electrodes is connected to one of the lower conductor layers. The one of the lower conductor layers has a protruding portion that protrudes to extend more outward in a lateral direction than a side surface of the insulating layer. The one of the terminal electrodes has a concave portion that accommodates and touches at least part of the protruding portion, and touches the side surface of the insulating layer.