A wired circuit board has a metal supporting board, an insulating layer
formed on the metal supporting board, a conductive pattern formed on the
insulating layer and having a plurality of wires arranged in mutually
spaced-apart relation, and a plurality of semiconductive layers formed on
the insulating layer and electrically connected to the metal supporting
board and the respective wires. The semiconductive layers are provided
independently of each other in correspondence to the respective wires.