A method of manufacturing a light emitting device including a light emitting element is provided, which includes a step of forming a first electrode, a step of forming an insulating layer including an opening over the first electrode, a step of forming a layer containing an organic compound on the first electrode and the insulating layer, a step of forming a second electrode on the layer containing the organic compound, a step of etching the layer containing the organic compound by plasma etching, and a step of connecting the second electrode and a wiring electrically connected to a terminal portion to each other through an adhesive containing a conductive particle.