A cleaning sheet which comprises a cleaning layer having a tensile stress at 10% strain of from 0.3 to 3,000 N/mm.sup.2 or a carrying member with a cleaning function wherein at least one side of the carrying member has a cleaning layer having a tensile stress at 10% strain of from 0.3 to 3,000 N/mm.sup.2, particularly, a cleaning sheet or a carrying member with a cleaning function of the aforementioned constructions, wherein the aforementioned cleaning layer comprises a resin layer having been hardened by an active energy source or a polymer resin having heat resistance.

 
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> Boring machine

> Method for holding semiconductor wafer

~ 00560