A conductive adhesive composition is provided and articles that include the adhesive composition as a component thereof. The conductive adhesive composition comprises: (a) pressure sensitive adhesive; (b) electrolyte comprising water soluble or water dispersible organic chloride; and (c) humectant. In some embodiments, the conductive adhesive composition is a bicontinuous composition comprising an aqueous phase and an oil phase, and the bicontinuous composition may be derived from a polymerizable microemulsion composition, the microemulsion composition comprising: an aqueous phase comprising one or more hydrophilic monomers or oligomers and/or one or more amphiphilic monomers or oligomers in water, the water-soluble or water-dispersible organic chloride, surfactant and humectant; and an oil phase comprising one or more hydrophobic monomers or oligomers. Biomedical articles such as biomedical electrodes, may incorporate the foregoing adhesive as a component.