A method of manufacturing a multilevel interconnect structure using a screen printing method is disclosed. In the multilevel interconnect structure, an interlayer insulating film having a through hole with a conductive bump therein, and a second interconnect line are stacked on a substrate with a first interconnect line formed thereon. The first interconnect line is electrically connected to the second interconnect line via the conductive bump. The method includes a step of forming a first region of the interlayer insulating film on the substrate with the first interconnect line formed thereon, the first region including a part of a peripheral wall of the through hole; a step of forming a second region of the interlayer insulating film on the substrate with the first region formed thereon, the second region including a remaining part of the peripheral wall of the through hole; and a step of forming the conductive bump.