One embodiment of the present invention sets forth an electronic assembly,
which comprises a printed circuit board having at least one opening, an
electronic component mounted on a first side of the printed circuit
board, and a thermal dissipation structure including at least one heat
sink having a first surface and a second surface. The first surface
includes a first region coupled with a surface of the electronic
component, and one or more second region provided with at least a heat
dissipating member that is exposed through the opening on a second side
of the printed circuit board.