The present invention provides a method for attaching an IC tag. In the method, an IC tag performing wireless communication using an electronic component appropriately disposed is attached to an article made from an elastically deformable material. Specifically, the IC tag is attached to a predetermined portion of the article, exclusive of a disposition section where the electronic component is disposed. The invention provides (i) an IC tag which is not damaged even when attached to an article made from an elastically deformable material, such as a tire used under extreme environment, (ii) a method for attaching the IC tag, and (iii) an article with the IC tag attached.