An electronic apparatus includes a circuit board, circuit elements mounted on the circuit board, and a cooling structure for cooling the circuit elements. The circuit elements include a heat generating element. The cooling structure includes a heat spreader, cooling fins integrally formed with the heat spreader, an air inlet, an air outlet, and a fan device for generating cooling air flowing from the air inlet to the air outlet. The heat spreader is placed above the circuit board and thermally joined to the heat generating element mounted on the circuit board. The cooling fins extend toward the circuit board to provide a plurality of air passages between the circuit board and the heat spreader. The air inlet and outlet communicate with each other through the air passages.