An input protection circuit comprises a semiconductor chip, an internal circuit disposed on the semiconductor chip, a first input/output terminal which is disposed on the semiconductor chip and connected to the internal circuit, a second input/output terminal which is disposed on the semiconductor chip, connected to the internal circuit and disposed at a position adjacent to the first input/output terminal, and a fusing part which is disposed on the semiconductor chip and connected between the first and second input/output terminals.

 
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< Damascene structure having a reduced permittivity and manufacturing method thereof

> Recycling by mechanical means of a wafer comprising a multilayer structure after taking-off a thin layer thereof

> Semiconductor device having through vias

~ 00549