A method of manufacturing an electronic circuit including employing a pick & place machine-specific component placement sequence, pick & place machine-specific component data for governing the operation of at least one specific pick & place machine in a manufacturing line and operating instructions in computer-readable language for the at least one specific pick & place machine to auto-generate generic component parameters for components used in manufacturing the electronic circuit on the at least one specific pick & place machine and employing the generic component parameters to auto-generate a pick & place machine-specific component placement sequence and pick & place machine-specific component data for governing the operation of at least one other specific pick & place machine in a manufacturing line and operating instructions in computer-readable language for the at least one other specific pick & place machine.